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Apple and Bitmain are expected to use TSMC’s bleeding-edge 2nm process node in 2026 and will act as the primary sources of its demand next year.
According to a new report from X, TSMC’s new 2nm process capacity is projected to hit 60,000 wafers per month by Q4 2026, while NVIDIA is expected to use TSMC’s 3nm node for its next-generation Rubin AI GPUs. TSMC is also expected to transfer some of its existing 5nm production line equipment and capacity to its 3nm process node.
We’ve been reporting for a while now that Apple would be shifting into using TSMC’s bleeding-edge 2nm process node in 2026, but it’s interesting — and expected — that Bitmain will be adopting the new N2 process node from TSMC. This is because Chinese Bitcoin mining companies have always been one of the first to use bleeding-edge process technologies.
Insider @Jukanrosleve added on X that a Bitcoin mining company “was actually the very first to use Samsung’s 3nm GAA process” and now the fact that Chinese crypto mining firm Bitmain will be among the first, alongside Apple, to adopt TSMC’s new 2nm process node is a significant development.
Apple is expected to use TSMC’s advanced WMCM (Wafer-Level Multi-Chip Module) and SoIC advanced packaging for its next-gen A20 and server chips in 2026, which will be one of the first chips on TSMC 2nm as most people aren’t going to run out and buy Bitmain’s new Bitcoin mining hardware using chips made on TSMC 2nm.
