Extreme Ultraviolet (EUV) Lithography Market by Component (Light Sources, Optics, Masks, EUV Metrology, EUV Sensors, EUV Subassembly) and End User (Integrated Device Manufacturers (IDMs), Foundries) – Global Forecast to 2029
The EUV lithography market size is expected to reach USD 22.69 billion by 2029 from USD 12.18 billion in 2024, at a CAGR of 13.2% during the 2024-2029 period.
The shift towards data-driven technologies, artificial intelligence (Al) and high-performance computing (HPC) applications is creating demand for more sophisticated and capable semiconductors. With data analytics, Al, and machine learning progressively being used within enterprises to improve decision-making and operational efficiency, the demand for high-density, high-performance integrated circuits (ICs) are at an all-time high. Fundamentally, EUV lithography is at the heart of this demand, which needs to produce the semiconductor that brings the computational power and energy efficiency that is required.
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EUV lithography plays an essential role for advancing the manufacturing of smaller transistors and tighter interconnects resulting in significant density and increase in computational performance. The precision patterning capabilities of EUV are necessary to produce more complex chip designs accurately, including those required by Al accelerators and deep learning processors. This enables semiconductor manufacturers to address the stringent performance demands of next-generation HPC applications.
Light source components are projected to have the highest CAGR during the forecast period from 2024 to 2029
The light source segment in extreme ultraviolet (EUV) lithography is anticipated to account for a major portion of the market as the component utilizes segments to generate extreme ultraviolet wavelengths required for high precision of semiconductors during the fabrication process. Liquid crystal (LC)-based instruments feature high resolution, vulnerability to resolution degradation, and high-throughput approaches. The need for high energy and brightness to realize the required fine resolutions for advanced manufacturing has led to a demand for laser-produced plasma (LPP) as an advanced light source.
Foundries end user is expected to have the largest market share and grow at the highest CAGR during the forecast period
The Foundries end-user is projected to have the largest market share and CAGR of extreme ultraviolet lithography due to their significant importance in delivering advanced semiconductor manufacturing services to fabless companies. Companies such as TSMC in Taiwan and Samsung Foundry in South Korea adopted and integrated of EUV technology, using it to create high-performance chips for an array of applications, such as AI, 5G, and advanced computing. Foundries dominate because they remain at the edge of technological innovation, offering leading-edge process nodes based intensely on EUV lithography for smaller geometries and, therefore, higher transistor density.
Asia Pacific region is projected to have the highest CAGR during the forecast period from 2024 to 2029
Asia Pacific will lead the market due to the industry’s domination in global semiconductor manufacturing and because of strong and prominent players such as TSMC, Samsung, and SK Hynix. Significant investments in advanced manufacturing capacities, with a robust technology infrastructure, further foster the growth of EUV technology across the region. Key governments, such as Taiwan, South Korea, and China, encourage the semiconductor industry with favorable policies, funding, and other initiatives that enhance domestic production. Moreover, the strong demand for next-generation electronics, such as smartphones, AI systems, and 5G devices, necessitates more advanced chips that EUV lithography allows.
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Key Players
The key players in EUV lithography are ASML (Netherlands), Carl Zeiss AG (Germany), NTT Advanced Technology Corporation (Japan), KLA Corporation (US), ADVANTEST CORPORATION (Japan), Ushio Inc. (Japan), SUSS MicroTec SE (Germany), AGC Inc. (Japan), Lasertec Corporation (Japan), TOPPAN Inc. (Japan), Energetiq Technology, Inc. (Japan), NuFlare Technology Inc. (US), Photronics, Inc. (Japan), HOYA Corporation (Japan), TRUMPF (Germany), Rigaku Holdings Corporation (Japan), Edmund Optics Inc. (US), Imagine Optic (France), Applied Materials, Inc. (US), Park Systems (South Koria), EUV Tech (US), Mloptic Crop. (China), MKS Instruments (US), Brooks Automation (US), and Pfeiffer Vacuum GmbH (Germany).
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